-
软件
-
服务
-
支持
-
见解
-
对比
-
更多
Futuremark Releases Revolutionary OpenGL ES 2.0 Benchmark
October 17, 2006
Futuremark Releases Revolutionary OpenGL ES 2.0 Benchmark
SimulationMark ES2.0 enables pre-silicon performance testing of 3D hardware designs
Saratoga, California USA - October 17, 2006 - Futuremark Corporation today announced SimulationMark ES2.0, an innovative new approach to benchmarking. The benchmark allows mobile device chipmakers and manufacturers to test and compare simulated 3D graphics performance in OpenGL® ES 2.0 chip designs prior to the fabrication of silicon based hardware implementations. SimulationMark ES2.0 will enable users to calculate reliable estimated performance data during the chip design phase comparing various graphics hardware architectures and application processor designs, while minimizing misuse and misinterpretation of those results.
SimulationMark ES2.0 is the only benchmark product currently available that will allow for the evaluation of OpenGL ES 2.0 performance of pre-silicon chip designs. The product is a combination of theoretical and practical shader test workloads based on high level shader and parameter descriptions published by Futuremark. Practical game test performance measurement is based on a Direct3D trace derived from Futuremarks successful 3DMark desktop benchmark product.
Futuremark brings eight years experience to the project, developing independent, industry standard 2D, 3D and system benchmarking applications, in addition to performance measurement of mobile graphics hardware. With the release of SimulationMark ES2.0, the mobile device industry will have access to the first benchmark intended to simulate accurate, consistent 3D performance prior to the investment in silicon hardware. Early access to simulated benchmark data will assist in setting performance requirements of future 3D hardware, and the selection of optimally performing designs.
SimulationMark ES2.0 is a revolutionary new approach in benchmarking for the whole industry, said Petri Talala, Futuremarks Vice President of Mobile Business. SimulationMark provides real-world workloads that generate 3D graphics performance data without having to run code on actual silicon. Before the release of SimulationMark, the mobile industry has had to rely solely on theoretical polygon and pixel processing data that didnt correlate well to real world performance, when making design choices for their upcoming 3D accelerated hardware.
OpenGL ES 2.0, 3D API for mobile hardwareCreated by the Khronos Group and its consortium of industry members, the OpenGL® ES API enables the authoring and playback of dynamic media on a wide variety of platforms and devices. OpenGL ES is a royalty-free, cross-platform API for embedded 3D graphics hardware on handheld devices. Derived from subsets of desktop OpenGL, it provides a powerful and flexible low-level interface between software and graphics acceleration with profiles for floating-point and fixed-point systems. OpenGL ES 2.0 enables full programmable 3D graphics. Futuremark, a contributing partner in the Khronos Group, has previously developed benchmarks targeted to measure the performance of devices with software implementation of OpenGL ES.
SimulationMark ES 2.0 is an innovative new tool in the expanding ecosystem around Khronos APIs which will significantly accelerate the real-world performance of OpenGL ES 2.0-based handsets and embedded systems, said Neil Trevett, President of the Khronos Group. Futuremark is one of the worlds most respected benchmarking companies and a strong innovator of embedded graphics tools. Khronos strongly welcomes their increasing involvement and investment in this fast growing segment of the graphics market.
AvailabilitySimulationMark ES2.0 documentation, descriptions and all relevant information required to create the test suite will be available in October, 2006 via license to any interested mobile industry manufacturer, chipmaker or developer.
About Futuremark® CorporationFuturemark ® Corporation is the leading provider of performance analysis software and services for PCs and smartphones. Futuremark® is known around the world for its benchmark products, including the 3DMark® and PCMark® Series and SPMark (with more than 30 million copies distributed worldwide) and value-added services powered by a database of over 13 million real life benchmarking results. Futuremark® maintains offices in Saratoga, California and Helsinki, Finland. For more information, please visit http://www.futuremark.com
© 2006 Futuremark® Corporation. 3DMark®, PCMark® and SPMark trademarks and logos, Futuremark® character names and distinctive likenesses, are the exclusive property of Futuremark Corporation. OpenGL® and the oval logo are trademarks or registered trademarks of Silicon Graphics, Inc. in the Untied States and/or other countries worldwide. All other trademarks are property of their respective companies.
Futuremark ContactFuturemark Corporation
Phone: +358 (0)20 759 8266
Mr. Petri Talala
Vice President of Mobile Business Unit
Email: petri.talala@futuremark.com
Recent news
-
New Opacity Micromap test now in 3DMark for Android
October 9, 2024
-
NPUs now supported by Procyon AI Image Generation
September 6, 2024
-
Test the latest version of Intel XeSS in 3DMark
September 3, 2024
-
Introducing the Procyon Battery Consumption Benchmark
June 6, 2024
-
3DMark Steel Nomad is out now!
May 21, 2024
-
Procyon AI Inference now available on macOS
April 8, 2024
-
Procyon AI Image Generation Benchmark Now Available
March 25, 2024
-
Announcing the Procyon AI Image Generation Benchmark
March 21, 2024
-
3DMark Steel Nomad will be free for all 3DMark users.
December 20, 2023
-
Using 3DMark to measure sustained performance.
December 13, 2023
-
New NPUs supported by Procyon AI Benchmark
November 16, 2023
-
A preview of 3DMark Steel Nomad
November 10, 2023
-
Qualcomm Uses Procyon AI Benchmark at Snapdragon Summit
November 1, 2023
-
3DMark celebrates its 25th year!
October 26, 2023
-
3DMark Adds iOS Support to Solar Bay Ray Tracing Benchmark
September 11, 2023